A Study on Novel Integrated Base Plate(IBP) Package for Power Electronics Module

2020-09-2310

Changli Zhang, Yongmo Kim, Ling Xu. A Study on Novel Integrated Base Plate(IBP) Package for Power Electronics Module. The 15th IEEE International Conference on Electron Devices and Solid-State Circuits(EDSSC). Xi'an, China, 2019, pp. 1-3

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