Xu, L., Zhou, S., & Lu, J*, Optimization of PCB Board to Improve Thermomechanical Reliability of Lead-Free Solder Ball Joint, 2018 19th International Conference on Electronic Packaging Technology (ICEPT), 1466–1471
Xu, L., Zhou, S., & Lu, J*, Optimization of PCB Board to Improve Thermomechanical Reliability of Lead-Free Solder Ball Joint, 2018 19th International Conference on Electronic Packaging Technology (ICEPT), 1466–1471