Optimization of PCB Board to Improve Thermomechanical Reliability of Lead-Free Solder Ball Joint

2019-03-08141

Xu, L., Zhou, S., & Lu, J*, Optimization of PCB Board to Improve Thermomechanical Reliability of Lead-Free Solder Ball Joint, 2018 19th International Conference on Electronic Packaging Technology (ICEPT), 1466–1471


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